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半导体芯片封装相关的温度和散热参数Theta-ja

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在估算芯片功耗的时候,会遇到2个温度参数:Junction Temperature和Ambient Temperature.百度了一把,发现了如下的定义:

  • case temperature指的是封装外壳表面的温度;
  • ambient temperature 指的是距离封装外壳表面1-2cm处的温度;
  • Junction temperature指的是半导体裸片温度;

Junction Temperature是我们通常所说的结温,就是半导体硅片的温度。

Ambient Temperature就是环境温度,结温到环境温度有个梯度,就是芯片的散热系数,专业的术语就叫做热阻Theta-ja。

Theta-ja = (Tjunction - Tambient)/Power

Theta-ja是描述了系统的散热性能。

温度位置示意图(仅供参考):

半导体芯片封装相关的温度

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